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Cosmotec Co., Ltd.

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SEMICONDUCTORS AND ELECTRONIC DEVICES

Manufacturing process of semiconductor components

We offer a lineup of special adhesive tapes and films that are widely used in the manufacturing and assembling processes of electronic components and semiconductors, as well as in process of precision processing such as the cutting and shipping of glass, ceramics, and semiconductors.Also customize the specifications of the tape to fit the customer’s process.

Surface protection and Masking
This tape is used to protect the surface in the sputtering and etching processes. Prevents the penetration of etching fluid and its conformity to bumps and bumps.

We offer a lineup of special adhesive tapes and films that are widely used in the manufacturing and assembling processes of electronic components and semiconductors, as well as in process of precision processing such as the cutting and shipping of glass, ceramics, and semiconductors.Also customize the specifications of the tape to fit the customer’s process.

Dicing
Fixing tape for use in the semiconductor and electronic component dicing process. Various types of tapes are available.

We offer a lineup of special adhesive tapes and films that are widely used in the manufacturing and assembling processes of electronic components and semiconductors, as well as in process of precision processing such as the cutting and shipping of glass, ceramics, and semiconductors.Also customize the specifications of the tape to fit the customer’s process.

Grinding
These tapes protect the wafer surface during back grinding and prevent contamination of the wafer surface due to ingress of grinding water and debris. We have a lineup of adhesive and UV removal types.

We offer a lineup of special adhesive tapes and films that are widely used in the manufacturing and assembling processes of electronic components and semiconductors, as well as in process of precision processing such as the cutting and shipping of glass, ceramics, and semiconductors.Also customize the specifications of the tape to fit the customer’s process.

Shipping
Various types of adhesive tapes are lined up.
Manufacturing process of multi-layer ceramic components
Dicing
Fixing tape for use in the semiconductor and electronic component dicing process. Various types of tapes are available.
Sheeting
Release film for lamination of dielectric sheets.
Compression
Release film for compression and forming of dielectric laminated sheets.
Edge Coating
This tape is used for temporary fixing of chips when applying external electrode paste to the edge surface of a chip after baking.
Transport
Various types of adhesive tapes are lined up.
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